Modem Celular Digi Xbee Cellular 3G

Modem Celular Digi Xbee Cellular 3G

Modem Celular Digi Xbee Cellular 3G

    59.990 59.990 59990.0

    SKU MCI04247
    Normal Price
    Discount by Quantity
    If you buy 10 pay $ 49.990 each one.
    Showroom MCI Store : Available
    Luis Thayer Ojeda Store : Available
    Viña del Mar Store : Sold Out

    Digi XBee Cellular 3G embedded modems provide OEMs with a simple way to integrate HSPA/GSM cellular connectivity into their devices.

    • FCC/IC, PTCRB, and AT&T certified – eliminates certification costs and risks
    • Transparent and API modes simplify software integration
    • Low-power modes for battery powered applications
    • Integrated MicroPython programmability enables custom scripting directly on the modem
    • Enhanced with Digi TrustFence™ security framework
    • Manage and configure with XCTU and Digi Remote Manager®
    • Available with Digi provided SIM cards and data plans

    Digi XBee Cellular 3G embedded modems provide a simple path to 3G (HSPA/GSM) with 2G fallback connectivity for OEMs with worldwide deployments. This modem is FCC/IC, PTCRB and AT&T certified which completely eliminates the cost, complexity, and risk involved in the certification process.

    The modem is programmable, with support for custom MicroPython applications running directly onboard, allowing users to more efficiently manage their devices and eliminating the need for an external microcontroller in certain use-cases. It includes the full suite of standard Digi XBee API frames and AT commands, so existing customers can simply drop this modem into their existing designs to instantly achieve 3G cellular integration, without the pain and hassle of doing a complete re-design.


    Interfaces and hardware:

    • CHIPSET REFERENCE: u-blox U201
    • CONFIGURATION METHODS: AT Commands, API Frames, local or OTA
    • OPERATING MODES: Transparent, API, Bypass
    • PROGRAMMABILITY: MicroPython with 8 KB Flash / 24 KB RAM
    • ANALOG I/O: 4 ADC lines (10-bit)
    • DIGITAL I/O: 13 DIO lines
    • FORM FACTOR: Digi XBee 20-pin through-hole
    • DIMENSIONS: 24.38 mm x 32.94 mm
    • OPERATING TEMPERATURE: -40º C to +85º C (-30 to +70C if 2G fallback is enabled)
    • SIM CARD: 4FF (Nano size) 

    Rf characteristics:

    • TRANSMIT POWER: Up to 24 dBm (Power Class 3)

    Networking and carrier:

    • CARRIER AND TECHNOLOGY: 3G HSPA/GSM with 2G fall-back (see User Guide for more details on this feature)
    • SUPPORTED BANDS: Band 19 (800 MHz), Band 5 (850 Mhz), Band 8 (900 MHz), Band 2 (1900 MHz), Band 1 (2100 MHz)
    • SECURITY: Digi Trustfence™ security with Secure Boot, Encrypted Storage, Protected JTAG, SSL/TLS 1.2
    • RF THROUGHPUT: Up to 921 Kbps
    • DOWNLINK/UPLINK SPEEDS: 7.2 Mbps / 5.76 Mbps

    Power requirements

    • SUPPLY VOLTAGE: 2.7 to 5.5 V
    • TRANSMIT CURRENT (24 DBM): 702 mA @ 3.3 V and 425 mA @ 5 V
    • RECEIVE CURRENT: 224 mA @ 3.3 V and 160 mA @ 5 V
    • IDLE CURRENT (LISTENING): 87 mA @ 3.3 V and 72 mA @ 5 V
    • DEEP SLEEP: 10 uA @ 3.3 V